Bergquist Sil Pad Tsp Q2000 - China

FEATURES AND BENEFITS • Thermal impedance: 0.35®C-in 2 /W (@50 psi) • Eliminates processing constraints typically associated with grease • Conforms to surface textures • Easy handling • May be installed prior to soldering and cleaning without worry BERGQUIST Q-Pad 3 eliminates problems associated with thermal grease such as contamination of electronic assemblies and reflow solder baths.

SIL PAD TSP Q2000 may be installed prior to soldering and cleaning without worry.

When clamped between two surfaces, the elastomer conforms to surface textures thereby creating an air-free interface between heat-generating components and heat sinks.

Fiberglass reinforcement enables BERGQUIST Q3 to withstand processing stresses without losing physical integrity.

It also provides ease of handling during application.

Company Contact:

• Posted By: Shenzhen hothree technology co., LTD

• Phone: 13798203669

• Address: Building F3, Jinyucheng Park, Longgang District, Shenzhen , Guangdong , China

• Email:

• Website: http://www.tim-home.com

• Business Description: Shenzhen Hothree Technology Co., Ltd. was established in 2011 - It is a technology-oriented company that is oriented to customer needs and is committed to providing customers with professional solutions for thermal conduction and EMI electromagnetic compatibility problems.
  
  The company mainly distributes thermal interface materials and shielding (EMI) materials for well-known brands such as Bergquist ,LAIRD in the US and Denka in Japan.
  
  At the same time, the company is also developing and integrating new high-performance products to meet system designers' requirements for thermal conductivity.
  
  Products are widely used in 5G communications, optical modules, security electronics, automotive electronics, outdoor base stations, lithium batteries, mobile phones, computers, LED, instruments, aerospace and medical equipment.
  
  Company culture, Integrity and pragmatism, quick response, keep improving.