Laird Tflex 300 Tflex360 - China

Laird Tflex 300 Tflex360 Laird Tflex 300, at pressures of 50psi, will deflect to over 50% the original thickness.

This high rate of compliancy allows the material to “totally blanket” the component, enhancing thermal transfer.

The material has a very low compression set enabling the pad to be reused many times.

Laird Tflex360 Tflex 300 Thermal Gap Filler Laird Tflex 300, in achieving its stellar compliancy, does not sacrifice thermal performance.

With a thermal conductivity of 1.2 W/mK, low thermal resistances can be achieved at low pressures.

Laird Tflex 300H is offered with a hard, metallized liner option for easy handling and improved rework.

The metallized liner’s lower coefficient of friction also allows for easy assembly of parts that must slide together, such as a card into a chassis.

Laird Tflex 300TG is offered with a cut-through resistant Tgard™ silicone liner.

The TG liner offers a guaranteed dielectric barrier, and easier part handling for mass production.

FEATURES AND BENEFITS • Extreme compliancy allows material to “totally blanket” components • Thermal conductivity of 1.2 W/mK • Low compression set enables the pad to be reused many times • Environmentally friendly solution that meets regulatory requirements including RoHS and REACH

Company Contact:

• Posted By: Shenzhen hothree technology co., LTD

• Phone: 13798203669

• Address: Building F3, Jinyucheng Park, Longgang District, Shenzhen , Guangdong , China

• Email:

• Website: http://www.tim-home.com

• Business Description: Shenzhen Hothree Technology Co., Ltd. was established in 2011 - It is a technology-oriented company that is oriented to customer needs and is committed to providing customers with professional solutions for thermal conduction and EMI electromagnetic compatibility problems.
  
  The company mainly distributes thermal interface materials and shielding (EMI) materials for well-known brands such as Bergquist ,LAIRD in the US and Denka in Japan.
  
  At the same time, the company is also developing and integrating new high-performance products to meet system designers' requirements for thermal conductivity.
  
  Products are widely used in 5G communications, optical modules, security electronics, automotive electronics, outdoor base stations, lithium batteries, mobile phones, computers, LED, instruments, aerospace and medical equipment.
  
  Company culture, Integrity and pragmatism, quick response, keep improving.