Repair Xbox360 Playstation 4 Machine Wds 660 Bga Chips Reballing Station For All Motherboard - China

WDS-660 BGA rework station

1 - built-in laser position

2 - optical alignment vision system

3 - CCD camera to make bga mounting, can move around

4 - high automatic & easy operation

5 - Large IR heating zone, good for xbox360, playstation etc

1 - Widely used in the Chip Level Repair in laptop, PS3, PS4, XBOX360, Moblie Phone, etc.

2 - Rework BGA, CCGA, QFN, CSP, LGA, Micro SMD, LED etc.

3 - Automatic Romoving, Mounting and Soldering.

4 - HD Optical Alignment system for precisely mounting BGA and Components.

5 - Laser Positioning function for Fast Positioning BGA Chip and motherboard.

6 - BGA mounting accuracy within 0.01mm , Repair success rate 99.9%.

7 - Superior Safety Functions, with Emergency protection.

8 - User-friendly operation system.

WDS-660 BGA rework station Specification:

1 - The Camera can rotate around, good for bga chips mounting, like xbox360, playstation etc

2 - High precision optical vision system with optical image, fine adjustment and 15 inch color LCD monitor.

3 - The machine could save 1-100 phases temperature curves.

4 - Three temperature zone independently.

5 - Three piece external temperature measurement interface detect temperature accurately.

6 - Super large IR heating zone, good for big motherboard work.

7 - High automatic avoid manual mistake.

Reworking lead free and double BGA board will be accurate.

8 - Adopt high power cross-flow wind to cool the PCB board quickly, preventing the PCB board from deformation to ensure soldering effect.

9 - Accurately inspect temperature by high accurate K-type thermocouple with closed loop control.

Total Power Max 6600W

Upper Heating Power 1200W

Lower Heating Power Second zone: 1200W, Third zone: IR 4200W

Power Supply (Single Phase)AC 220V±10V 50Hz±3Hz 5.4 KVA

Machine Dimension L1200*W800*H900mm(not including LCD stand)

Positioning Way V-shape card slot, PCB holder can be adjustable by X and Y axes

Temperature Controlling K-type thermocouple closed loop control, independent temperature control

PCB Size(Max) 500*500mm

PCB Size (Min) 10*10mm

BGA Application Max.

80*80mm, Min.

1*1mm

Chip Blowup Diploid 2-50X

Temp.

difference among four-corner of hot air nozzle ±3 degree

Weight of machine 110Kg

Thermocouple Ports 3units

Any question, please leave us your inquiry, thank you! we will reply you within 24 hour !

Company Contact:

• Posted By: Shenzhen Wisdomshow Technology Co.,Ltd.

• Phone: 86 137-1412-9564

• Address: Building B,No.6 Haosi Western Industrial Park, Shajing Town, Bao'an District, , Shenzhen , Guangdong , China

• Email:

• Website: http://www.wdsbga.com/

• Business Description: Shenzhen WisdomshowTechnology Co., Ltd specializes in BGA Rework Station for nearly seven years and enjoy high reputation in the worldwide
  
  market.
  
  We mainly produce and distribute BGA reballing station, Hot air BGA rework station, Infrared BGA rework station, laptop motherboard repair machine, BGA chip repair machine, and other relative chip level repair tools, like BGA reballing kit, stencils, flux paste, solder ball, BGA preheaters, etc.