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Laird Tflex 600 Thermal Gap Filler - China

price: 1.00 Dollar US$

FEATURES AND BENEFITS • Very high compliancy for low stress applications • 3 W/mK thermal conductivity • Available in thicknesses from 0.020” - 0.200” (0.5mm - 5.0mm) • Naturally tacky, needs no further adhesive coating Laird Tflex 600 is an exceptionally soft, highly compliant gap filling interface pad with a thermal conductivity of 3 W/mK.

These outstanding properties are the result of a proprietary boron nitride filler in the composition.

The high conductivity, in combination with extreme softness produces incredibly low thermal resistances.

Laird Tflex 6100 is naturally tacky and requires no additional adhesive coating that can inhibit thermal performance.

Thermal Gap Filler is electrically insulating, stable from –45°C to 200°C and meets UL 94 V0 rating.


Company Contact:


  • Phone: 13798203669

  • Address: Building F3, Jinyucheng Park, Longgang District, Shenzhen , Guangdong , China

  • Email: Email


Published date: August 3, 2022

  • Business Description: Shenzhen Hothree Technology Co., Ltd. was established in 2011 - It is a technology-oriented company that is oriented to customer needs and is committed to providing customers with professional solutions for thermal conduction and EMI electromagnetic compatibility problems.

    The company mainly distributes thermal interface materials and shielding (EMI) materials for well-known brands such as Bergquist ,LAIRD in the US and Denka in Japan.

    At the same time, the company is also developing and integrating new high-performance products to meet system designers' requirements for thermal conductivity.

    Products are widely used in 5G communications, optical modules, security electronics, automotive electronics, outdoor base stations, lithium batteries, mobile phones, computers, LED, instruments, aerospace and medical equipment.

    Company culture, Integrity and pragmatism, quick response, keep improving.

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