Lead Free Bga Rework Station Wds 650 With Optical Alignment For Laptop Computer - China

Field of applications

Business field

• Laptop and mother boards rework and repair.

• Game consoles applications rework and repair.

• Small and medium size electronics assembly factories.

• Military sophisticated applications rework and repair.

• Medical equipment applications rework and repair.

• Automotive applications rework and repair.

• Light systems and LED applications.

• Home appliance and personal Gadgets applications rework and repair.

• Networking and communication applications rework, repair and assembly.

• Power supply and control PCB applications rework, repair and assembly.

Components type

• BGA on Flex printed circuit.

• PTH connectors, card slots and sockets.

• Metal components housing.

• Micro lead frame.

• PBGA with heat sink.

• Processor plastic sockets.

• Metal Shielding.

• CSP and fine pitches BGA.

• Plastic PLCC.

• Through hole sockets.

• Heavy Mass CCGA & CBGA.

• Underfill or epoxy coated components.

• QFN, VQFN and advanced design QFN.

• Package over package (POP).

WDS-650 Main features:

1 - Widely used in the Chip Level Repair in laptop, PS3, PS4, XBOX360, Moblie Phone, etc.

2 - Rework BGA, CCGA, QFN, CSP, LGA, Micro SMD, LED etc.

3 - Automatic Romoving, Mounting and Soldering.

4 - HD Optical Alignment system for precisely mounting BGA and Components.

5 - Laser Positioning function for Fast Positioning BGA Chip and motherboard.

6 - BGA mounting accuracy within 0.01mm , Repair success rate 99.9%.

7 - Superior Safety Functions, with Emergency protection.

8 - User-friendly operation system.

WDS-650 automatic BGA Rework Station Main features:

Easy operate, 100% success rate.

1 - Auto pick and remove function, do not need joystick.

2 - High resolution optical alignment system and HD camera system + 3 axies micro adjust, accurate bga positon, ensure precise mounting.

3 - Built-in infrared laser position, fast positioning for PCB.

4 - Nozzle, equiped with many size nozzles, which also can be customized.

5.3 temperature zones controlled independently, the upper and lower is hot air, the 3rd is IR pre-heating.

7 - With a powerful cross-flow and 3 external temp sensor socket

8 - High sensitive touch screen, Panasonic PLC control.

9 - Alarm function and double over-temperature protection.

Position : V-groove+laser position+universal fixture.

WDS-650 BGA Rework Station Technical parameter

1 - Total power 5300W

2 - Upper heating power 1200W

3 - Lower heating power Second temperature zone 1200W, Third temperature zone2700W

4 - Power supply (Single Phase)AC 110V/220V±10 50Hz±3 5.2KVA

5 - Overall dimension L880*W880*H720mm ( not include the display holder)

6 - Locating way V-shaped groove, PCB holder can adjust any direction of X, Y

7 - Temperature controlling

(high precision K-sensor)(Closed Loop), UP and down can test the temperature independently

8 - Large PCB size 450*430mm

9 - Small PCB size 10*10mm

10 - Chip zoom multiple 2-50 multiple

11 - Weight of machine 85kg

Want to know more information about the bga rework station, please leave us your inquiry, or contact us via e-mail, thank you friends!

Company Contact:

• Posted By: Shenzhen Wisdomshow Technology Co.,Ltd.

• Phone: 86 137-1412-9564

• Address: Building B,No.6 Haosi Western Industrial Park, Shajing Town, Bao'an District, , Shenzhen , Guangdong , China

• Email:

• Website: http://www.wdsbga.com/

• Business Description: Shenzhen WisdomshowTechnology Co., Ltd specializes in BGA Rework Station for nearly seven years and enjoy high reputation in the worldwide
  
  market.
  
  We mainly produce and distribute BGA reballing station, Hot air BGA rework station, Infrared BGA rework station, laptop motherboard repair machine, BGA chip repair machine, and other relative chip level repair tools, like BGA reballing kit, stencils, flux paste, solder ball, BGA preheaters, etc.