Series Glass And Fused Silica Wafers - China

Series Glass & Fused Silica Wafers

CQT uses a variety of glass and quartz depending on the application and material requirements.

Our designers and engineers are skilled at working with any number of glass and quartz materials to machine and fabricate precision optical products such as fused quartz parts for optics, fused silica parts used in fiber optic applications, and borosilicate glass parts found in semi-conductor manufacturing.

Product Parameters

The general specs are as follows sheet, if your specified is not included with it, you may freely tell us and we’ll pleased to customize them for you.

Find here details of CQT selling lithium niobate wafer, lithium tantanlate wafer, piezo single crystal blanks and glass substrates for biochemistry.

spec unit 6" 8" 10" 12”

Diameter/size(or square) mm 150 200 250 300

Tolerance (±) mm 0.2 0.2 0.2 0.2

Thickness mm 0.30 or more 0.40 or more 0.50 or more 0.50 or more

Primary reference flat mm 57.5 Semi-notch Semi-notch Semi-notch

LTV (5mmx5mm) µm < 0.5 < 0.5 < 0.5 < 0.5

TTV µm < 3 <3 <5 <5

Bow µm ±30 ±40 ±40 ±40

Warp µm ≤ 40 ≤ 50 ≤ 50 ≤ 50

PLTV(5mm*5mm)<0.4um % ≥95% ≥95% ≥95% ≥95%

Edge Rounding mm

Surface Type Polished side Ra nm

Back Side Criteria µm

CQT dedicated to produce series glass wafers, fused silica wafers, SAW grade lithium tantalate wafers, optical grade lithium tantalate wafers, SAW grade lithium niobate wafers, optical grade lithium niobate wafers.

CQT is a leading Chinese manufacturer who involves in piezoelectric crystals, surface acoustic wave filters and the single crystal growth.

Process capability: Item Capability

Diameter 5mm - 400mm

Thickness 50μm or more

Dimensional Tolerance +/- 25μm

Thickness Tolerance +/- 5μm

Thickness Variation(TTV) < 2μm

Flatness 1/10 Wave/Inch

Surface Roughness (RMS) <5Ǻ

Scratch and Dig 10/5

Particle Size <10μm

Bow/Warp <10μm

Related Products

Company Contact:

• Posted By: Hangzhou Freqcontrol Electronic Technology Ltd

• Phone: 86-571-85803723

• Address: NO.1106, Crystal International Business Center(CIBC), No.198 Wuxing Rd ,Qianjiang new city, Jiangga, Hangzhou , Zhejiang , China

• Email:

• Website: http://www.csimc-freqcontrol.com/

• Business Description: Splitting up from former China National Scientific instrument and materials company in 1999 , Hangzhou Freqcontrol Electronic Technology Ltd., is a leading Chinese manufacturer who involves in piezoelectric crystals, surface acoustic wave filters and the single crystal growth as well as substrates process which for use in the telecommunications and general time and frequency industries.
  
  Rely on our manufacturing facilities and our sister partners we register this organization as CQT (China Quartz Technology ) for the strategic cooperation, we are able to supply a very broad range of all high precision single quartz blanks with all different possible orientation for TC control, ithium Niobate and lithium Tantalate substrates (3”, 4” and 6”) for RF signal picking up in Smart Mobile and all Custom sized special glass substrates for Optical windows as well as all commercial-end frequency controlled component at BULK and SAW industry for 3G, 4G, and 5G application.
  
  Optical Grade Quartz Wafers, Fe doped LT Wafers, Finsihed Crystal Manufacturer .
  
  We have been servicing for microelectronic manufacturers, defense related contractors, National laboratories, universities and scientists around the world since 1990 - our expertise is specialty on the single piezo crystal science, all kinds of quartz blank and lithium Niobate Lithium Tantalate wafer manufacture, We are committed to the supply of all types of substrate wafers to the microelectronics industry.
  
  We focus on innovation, cost-effectiveness, and superior quality for our customers.
  
  Our accomplishments are the result of the combined efforts of all of our employees, who are dedicated to the highest ethical and quality standards.
  
  From 2007 marked our continued expansion with the addition of LN , LT , QTZ substrate products on 3” , 4” and also 6” with the most thinner at 0.1-0.15 mm which will make chips to be possible to be packed within more the most of smallest packages.
  
  Up to 2010 years, we developed production capability to all different kind of glass substrates up to 12” to apply for both semiconductor and optical industry.
  
  Expansion into existing markets with leading edge products that exploit today's advanced manufacturing technologies has become the mainstay of our successful business growth.