Substrate Free Conductive Adhesive Film - China

1, thickness: 0.01mm, 0.015mm, 0.2mm, 0.25mm, 0.03mm, 0.035mm, 0.04mm, 0.045mm, 0.05mm, 0.07mm, 0.1mm 2, resistance: ≤0.05Ω 3, viscosity: ≥1.2KG /25mm 4, Width: 5MM~1070mm 5, Length: 50M~ANY The non-substrate conductive tape produced by our company has good film forming performance, high viscosity, anti-lifting, and is suitable for compounding with various conductive materials, such as it.

Composite with copper foil, aluminum foil, conductive cloth, conductive sponge and other materials.

Company Contact:

• Posted By: DONGGUAN DONGYAN ELECTRONIC MATERIAL TECHNOLOGY CO.,LTD

• Phone: 86-0769-85305921

• Address: Building H, No. 93, Daxin Road, Dazhou Community, Qiaotou Town, Dongguan City, Dongguan , Guangdong , China

• Email:

• Website: http://www.dongyandianzi.cn

• Business Description: Founded in 2013, Dongguan Dongyan Electronic Material Technology Co., Ltd. It is a professional conductive shielding, heat-dissipating and heat-dissipating material and special adhesive production enterprise integrating R&D, production, sales and service.
  
  In May 2018, the company moved to the famous lotus town in China---Qiaotou Town, Dongguan.
  
  Dongyan Electronics specializes in solving a series of shielding and heat dissipation problems such as electromagnetic signal interference, electronic component heating, etc., and develops according to customer needs, and allocates various special materials suitable for the specific production process.
  
  Dongyan Electronics has introduced two of the most advanced coating production lines in the industry at home and abroad, equipped with standard dust-free workshops for production, ensuring quality and reassuring customers.
  
  Dongyan Electronics is one of the first companies to participate in the research and development of nano-carbon series heat dissipation, graphene series heat dissipation and other new heat dissipation materials, and has won a good reputation in the industry.
  
  Dongyan Electronics focuses on R&D, recruits industry elites from the society and universities to join Dongyan R&D, and establishes long-term technical cooperation relationship with Zhongyan Chemical, Chinese Academy of Sciences, etc., and directed to Huawei, ZTE and other mobile terminals to develop new thermal conduction heat dissipation.
  
  material.