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Low Coefficient Of Thermal Expansion Cte And High Modulus Polyimide Film For Fpc Fccl - China

price: 15.00 Dollar US$

Low Coefficient Of Thermal Expansion Cte And High Modulus Polyimide Film For Fpc Fccl

Products Photos Catalog Coefficient Thermal Photos Catalog

Low CTE and High Modulus Polyimide Film ( Low CTE and High Modulus PI Film for FPC FCCL) Low CTE and High Modulus Polyimide Film is a kind of biaxially stretched film produced by special formula and production process.

This product not only has the comprehensive excellent properties of ordinary polyimide film, but also has the functional characteristics of high elastic modulus and low thermal expansion coefficient, which shows low thermal shrinkage and high dimensional stability.

use for FPC FCCL.

Low CTE and High Modulus Polyimide Film is mainly used in FPC field, especially suitable for the manufacturing requirements of copper clad laminate, Flexible printed circuits, Fine pitch circuitry.

Yancheng Tiandi Insulation Co., Ltd


Company Contact:


  • Phone: 86-139-61986280

  • Address: no.12 road, http://www.polyimide-pi.com, yancheng , China

  • Email: Email


Published date: September 18, 2024

  • Business Description: Polyimide Film and Polyimide Film Tape

    Polyimide Tape, kapton tape, Heat-Resistant Tape, High Temperature Insulation Tape

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