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Docbond High Thermal Conductivity Epoxy Adhesive - China

price: 200.00 Dollar US$

Docbond High Thermal Conductivity Epoxy Adhesive

Products Photos Catalog Docbond Thermal Photos Catalog

DB118 This product is a one-component epoxy resin adhesive with high thermal conductivity, which is the best matching adhesive for thermal bonding of chips.

Applicable to all kinds of electronic products, characterized by rapid thermal curing, and easy to apply.

Upon cure, it has high bonding strength, good thermal conductivity, low shrinkage, low moisture absorption, good insulation performance, etc., which can reduce the working temperature of the chip, extend the life of the chip


Company Contact:


  • Phone: 13149307058

  • Address: 9/F,innovation buliding,Petrochemical Avenue,Huiyang District, Huizhou , Guangdong , China

  • Email: Email


Published date: April 19, 2023

  • Business Description: Huizhou DOCBOND New Material CO.

    LTD is a national high-tech enterprise specializing in the research and development, production, and market promotion of new materials such as fuel cell adhesive and composite bipolar plate substrate in the field of hydrogen energy.

    DOCBOND was incorporated in November 2014 and settled in the accelerator of fine chemical technology enterprise in the petrochemical zone of Daya bay economic and technological development zone in Huizhou， and received two rounds of investment funds from the local government

    DOCBOND's primary research and development products have two major sections: high-end electronic adhesives and adhesives for hydrogen energy fields.

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