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Docbond Low Temperature Curing Adhesive - China

price: 20.00 Dollar US$

Docbond Low Temperature Curing Adhesive

Products Photos Catalog Docbond Temperature Photos Catalog

DB291 This product is a single component, low temperature fast heat curing modified epoxy resin adhesive.

Excellent adhesion between many different types of materials at lower temperatures and in a very short time.

The product has excellent working performance and high storage stability.

This product is suitable for low-temperature curing process, mainly used for bonding heat-sensitive components, suitable for memory cards, CCD/CMOS, LED backlights etc.


Company Contact:


  • Phone: 13149307058

  • Address: 9/F,innovation buliding,Petrochemical Avenue,Huiyang District, Huizhou , Guangdong , China

  • Email: Email


Published date: April 19, 2023

  • Business Description: Huizhou DOCBOND New Material CO.

    LTD is a national high-tech enterprise specializing in the research and development, production, and market promotion of new materials such as fuel cell adhesive and composite bipolar plate substrate in the field of hydrogen energy.

    DOCBOND was incorporated in November 2014 and settled in the accelerator of fine chemical technology enterprise in the petrochemical zone of Daya bay economic and technological development zone in Huizhou， and received two rounds of investment funds from the local government

    DOCBOND's primary research and development products have two major sections: high-end electronic adhesives and adhesives for hydrogen energy fields.

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