Silicon Wafer Edge Grinding Wheels - China

Silicon wafer back grinding wheels are mainly used for the thinning and fine grinding of the silicon wafer.

Coolant: Oil, emulsion

workpiece processed: silicon wafer of discrete devices, integrated chips (IC) and virgin, ATM, Melchiorre, Peter Wolters, Diskus, Viotto, Wendt

Material of workpiece: monocrystalline silicon and some other semiconductor materials.

Grinders: SHUWA SGM-6301, NTS Nanosurface-180G, NTS Nanosurface 250/NC-VDM Main role of back grinding wheel

In the middle of the pre-production process, thick silicon wafer can reduce damage; before assembly, silicon wafer is thinned, which is conducive to heat dissipation; reduce package volume; improve mechanical strength (softer after thinning, softer after thinning, minus Small stress); improve electrical performance (short connection); reduce the workload of dicing wafer Vitrified bond suitable for silicon wafer back grinding wheel

Vitrified bond diamond grinding wheel bond agent has higher strength; good wear resistance, sharp cutting Grinding efficiency is high, and easy to trim; generally suitable for silicon wafers, such as rough grinding, semi-finishing grinding, etc.

The diamond grinding wheel has good self-sharpening performance and is not easy to clog; the grinding efficiency is high, the grinding force is small, and the grinding temperature is low The bonding agent itself has good elasticity and polishing performance; the workpiece has high surface finish and good surface quality; it is suitable for fine grinding and polishing of silicon wafers.

The Specification Of Diamond Back Grinding Wheels:

Model Diameter (Mm) Thickness (Mm) Hole (Mm) 6A2 175 30, 35 76 200 35 76 350 45 127 6A2T 195 22.5, 25 170 280 30 228.6 6A2T(Three Ellipses) 350 35 235 209 22.5 158

Other Size Can Ba Made According To Customers Requirements silicon wafer back grinding wheel features: 1, surface quality: require grinding lines evenly, without chipping, debris, scribe, etc.

; 2, processing accuracy: TTV <5 μm etc.

(Total thinning veracity); 3, processing quality: surface roughness: < 10 nm; damage layer thickness: < 10 μm; Application of back grinding wheel The grinding wheels for LED substrate are mainly used for back thinning of sapphire epitaxial wafer, silicon wafer, gallium arsenide and GaN wafer.

Workpiece processed: sapphire epitaxial wafer, silicon wafer, gallium arsenide and GaN wafer.

Material of workpiece: synthetic sapphire, single crystal silicon, gallium arsenide and GaN materials.

If you need any products, do not hesitate to contact

Annamoresupe#gmail.

com

Anna.

wang#moresuperhar d.

com

WhatsApp: +861561778592 3

Skype: Annawng

Wechat: 15617785923

QQ: 1664333593

Mobile: +86-15617785492 3

Tel/Fax: +86-0371-86545 906

Company Contact:

• Posted By: More super hard company

• Phone: 86-371-86545906

• Address: No.171 Zhongyuan Rd, Zhongyuan District, Zhengzhou, Henan,450001 China, zhengzhou , henan , China

• Email:

• Website: https://www.moresuperhard.com

• Business Description: More Super Hard Products Co., Ltd Is Specialized In Manufacturing And Marketing Of Synthetic Diamond Tools, Cubic Boron Nitride(CBN) Tools, Which Is Widely Used In Petroleum & Geology Industry, Auto Aviation Processing Industry, Electric Processing Industry, Natural Diamond And Jewelry Processing Industry And Other Ultra- Precision Industry .
  
  petroleum and geology industry automobile industryPCD and PCBN tools natural diamond processing
  
  The Company's Production And Sales Of Products Covered Vitrified Bond Tools, Resin Bond Tools, Metal Bond Tools, Electroplated Diamond/CBN Tools, Vaccum Brazed Products, CVD Diamond Tools, Polycrystalline Diamond (PCD) Tools, Cubic Boron Nitride (CBN) Tools.
  
  Our Objective Is To Meet All The Customers Needs And Help Every Customer Achieve Maximum Benefits.
  
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