6w Thermal Gel Is Ideal For High Powered 5g Telecom Devices - China

With the explosive growth of 5G infrastructure deployment, the demand of 5G modules is increasing.

The devices work at a very hight speed while delivering smooth and efficient performance in a small package, thus generating huge amount of heat inevitably.

Overheating is one of the most critical causes for device failure, for solving this problem, the leading companies of 5G equipment manufacturing are developing thermal management solutions.

Thermal interface materials are the core of thermal management, that’s the point.

GLPOLY thermal gel XK-G60 is designed for improving thermal management of 5G modules such as optical transceivers, servers and routers, and has been approved for serial production by some top class clients such as DT Mobile, TINNO Mobile.

5G devices are always deployed in exposed environment, they must withstand severe conditions shuc as high temperature in summer and low temperature in Winter, this requires thermal interface materials performing more reliably to ensure heat transfer effective.

GLPOLY thermal gel XK-G60 is a one component, non-curing, non-dry out, dispensable or printable, liquid gap filling material with a thermal conductivity of 6.0W/mK.

It will wet out interfaces and never dyr out, decreasing contact thermal resistance, improving thermal contact and heat transfer.

This material accommodates a variety of bondline thickness, filling different gap thickness.

XK-G60 deflects under low compressive forces, decreasing stress on components thus decreasing component failures.

GLPOLY thermal gel XK-G60 has following strengths:

1 - thermal conductivity 6.0W/mK, non-curing, non-dry out, low contact thermal resistance;

2 - Performance and reliablity are approved by practical application;

3 - Compatible with high volume, automated production dispense processes; GLPOLY thermal gel XK-G60 takes top spot on supply list of thermal interface materials for 5G in industry.

GLOLY has a range of thermal interface materials including thermal gap pad, thermal gap filler, thermally conductive structural adhesive and thermal gel etc, serving LG, DJI, DT Mobile, GAC NE Motor, NIO Motor and more.

With GLPOLY, you can be rest assured about thermal management.

Company Contact:

• Posted By: Goldlink Tongda Electronics Co., Ltd

• Phone: +8675527579310

• Address: Block 45, Baoan Shenzhen China, Shenzhen , Guangdong , China

• Email:

• Website: https://www.glpoly.com

• Business Description: Goldlink Tongda Electronics Co., Ltd is committed to the design, development and manufacture of Thermal Interface Materials, developing high quality TIMs and Thermal Solution is our first priority.
  
  Our outstanding R&D team are able to deliver the effective thermal solutions to customers for facing current advanced products.
  
  Products
  
  Busin ess includes Thermal Silicone Pad, Silicone Putty Pad, Thermal Tape, Thermal Silicone Grease, Two-part Thermal Gap Filler, Thermal Gel, Phase Change Materials and Non-Silicone based products.
  
  
  
  Applications
  
  We serve a multitude of industries worldwide including New energy vehicles, UAV, computer, telecommunications, consumer electronics, optical products, LED lighting, air flight, storage device, military and medical equipment, power conversion.