Glpoly 5 0w Mk Thermal Gap Pad Is Similar To Bergquist Gp 5000s35 - China
price: 12.00 Dollar US$
GLPOLY high performance thermal gap pad is comparable with Bergquist Gap Pad 5000S35 - GLPOLY XK-P50 is a high performance, high compressive rate thermal gap pad, comparable to Bergquist Gap Pad 5000S35, which has been applying to military equipment.
It is reality.
An Research Institute from Beijing contacted GLPOLY and consulted about a thermal gap pad that could subsitute for Bergquist Gap Pad 5000S35 - After reviewing the comparison report, customer asked for some samples for test.
Six months later, we received great news, customer told me that XK-P50 thermal gap pad had been verified by High Temperature Aging Test at 150 centigrade for 1000 hours, value of all parameters changed less than 5%.
This material had been introduced into supplier system instead of Bergquist Gap Pad 5000S35, it would be applied to military equipment in volume production.
This was the first time we had been told that this was a military project.
Actually, this was not the first time we competed with Gap Pad 5000S35 - Two years ago, we had collaborated with a aerospace equipment company, providing XK-P50 thermal gap pad replacing Bergquist Gap Pad 5000S35 - GLPOLY XK-P50 thermal gap pad has the features:
1 - Thermal conductivity 5.0W/mK, low thermal resistance
2 - Low hardness, conformable to topography of component
3 - Proven reliability under extreme temperature cycling GLPOLY has partnered with top class brands such as Freetech Auto Polit, dJI, GAC New Energy Vehicle, NIO Automotive and more, providing superior thermal interface materials for clients to protect their brand reputation for performance and reliability.
GLPOLY serves top ten clients in the industries they engaged.
Company Contact:
- Posted By: Goldlink Tongda Electronics Co., Ltd
- Phone: +8675527579310
- Address: Block 45, Baoan Shenzhen China, Shenzhen , Guangdong , China
- Email:
- Website: https://www.glpoly.com
Published date: December 10, 2020
- Business Description: Goldlink Tongda Electronics Co., Ltd is committed to the design, development and manufacture of Thermal Interface Materials, developing high quality TIMs and Thermal Solution is our first priority.
Our outstanding R&D team are able to deliver the effective thermal solutions to customers for facing current advanced products.
Products
Busin ess includes Thermal Silicone Pad, Silicone Putty Pad, Thermal Tape, Thermal Silicone Grease, Two-part Thermal Gap Filler, Thermal Gel, Phase Change Materials and Non-Silicone based products.
Applications
We serve a multitude of industries worldwide including New energy vehicles, UAV, computer, telecommunications, consumer electronics, optical products, LED lighting, air flight, storage device, military and medical equipment, power conversion.
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