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Glpoly Suppport Customer In Fpga Chip Thermal Management Verification Of Medical Equipment - China

price: 3.60 Dollar US$

GLPOLY provides technical support for customer for FPGA thermal management.

GLPOLY is committed to solving thermal management problems, providing not only high performance thermal interface materials, but also technical consultance and support.

Many competitors provided several type of products when customer asked for samples.

Why? Because they never helped customers verify practicability, but left the problems to customers themselves.

GLPOLY never do business like this.

We will study customers’ idea and desgin, simulating actual application status and verify the performance.

I received an enquiry about medical equipment thermal management, applicationn temperature is about 50 degree celsius, PCB will be packaged in a sealed steel chamber.

The heat that generated by PCB in chamber will be transfer from water cooling plate to air.

PCB interface was irregular topography, the difference in height was 1.5mm, and gap between the highest point and cooling plate is 0.8mm.

Customer wanted to use an appropriate (lowest) thermal conductivity thermal interface materials with low hardness for reducing cost.

They designed a 1.5-2.0W/mK thermal interface material to application and wanted us to verify the practicability for them.

We calculated the data according the power, area etc, then we recommended a 1.5W/mK thermal gap pad to customer.

We simulated the application environment and test the PCB.

Two weeks later, we got the data, it was really close to our calculation-2.0W/mK was enough for this application.

So I sent several samples to customer for assembly and testing.

One month later, customer told me our solution was good, trial production will be proceeded in next month.

GLPOLY thermal interface materials have been applying to 5G telecom equipment, automotive electronics, new energy vehicle battery pack, drone, smartphone and more.

GLPOLY will provide technological advanced thermal solution for you to keep your devices run reliably.


Company Contact:


  • Phone: +8675527579310

  • Address: Block 45, Baoan Shenzhen China, Shenzhen , Guangdong , China

  • Email: Email


Published date: March 3, 2021

  • Business Description: Goldlink Tongda Electronics Co., Ltd is committed to the design, development and manufacture of Thermal Interface Materials, developing high quality TIMs and Thermal Solution is our first priority.

    Our outstanding R&D team are able to deliver the effective thermal solutions to customers for facing current advanced products.

    Products

    Busin ess includes Thermal Silicone Pad, Silicone Putty Pad, Thermal Tape, Thermal Silicone Grease, Two-part Thermal Gap Filler, Thermal Gel, Phase Change Materials and Non-Silicone based products.



    Applications

    We serve a multitude of industries worldwide including New energy vehicles, UAV, computer, telecommunications, consumer electronics, optical products, LED lighting, air flight, storage device, military and medical equipment, power conversion.

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