Glpoly Thermal Putty Gel Emerged As The Best One In China Mobile 5g Project Tender - China
price: contact company for price
A lot of thermal management materials suppliers aimed at 5G telecom equipment thermal management under the guidance of “new infrustructure” strategy and declared that they could provide diversified thermal interface materials for customers to solve heat transfer problems.
Is it real? Absolutely not.
According to the survey, most of suppliers only provided low end thermal management materials in the last several years, they adjusted product strategy and development hastily in this great change.
On the contrary, GLPOLY has been developing high performance thermal management materials for 5G&6G applications and achieving a lot.
Raw materials of GLPOLY thermal interface materials are imported from Japan and Germany which will be controlled at source.
GLPOLY has introduced fully automated production line eliminating artificial error.
And more, all products had been verified by third party, no matter performance or reliability will makes customers satisfied.
In April, China Mobile put 5G project out to tender, attracting a lot of suppliers.
Through strict reliability test, GLPOLY thermal gap pad emerged as the qualified one, also GLPOLY is the only domestic brand.
GLPOLY thermal gap pad for 5G has advantages:
1) Extremely low thermal resistance of 0.16℃in2/W, 20% lower than that of rivals’
2) 10-year reliability test verified by third party
3) Imported raw material with superior quality Now, GLPOLY high performance thermal gap pad has been applied to military equipments.
Also GLPOLY has partnered with Huawei, NIO, GAC etc top class brands.
GLPOLY thermal management materials provides high performance and brings you superior desgin flexibility.
Company Contact:
- Posted By: Goldlink Tongda Electronics Co., Ltd
- Phone: +8675527579310
- Address: Block 45, Baoan Shenzhen China, Shenzhen , Guangdong , China
- Email:
- Website: https://www.glpoly.com
Published date: July 13, 2020
- Business Description: Goldlink Tongda Electronics Co., Ltd is committed to the design, development and manufacture of Thermal Interface Materials, developing high quality TIMs and Thermal Solution is our first priority.
Our outstanding R&D team are able to deliver the effective thermal solutions to customers for facing current advanced products.
Products
Busin ess includes Thermal Silicone Pad, Silicone Putty Pad, Thermal Tape, Thermal Silicone Grease, Two-part Thermal Gap Filler, Thermal Gel, Phase Change Materials and Non-Silicone based products.
Applications
We serve a multitude of industries worldwide including New energy vehicles, UAV, computer, telecommunications, consumer electronics, optical products, LED lighting, air flight, storage device, military and medical equipment, power conversion.
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