Glpoly Thermal Putty Pad Is Highly Comformable To Part - China

GLPOLY Low Stress Thermal Gap Pad Helps Improve Thermal Contact of Irregular Interface, Optimizing Heat Transfer.

GLPOLY Thermal gap filler pad is a ultra soft, high compression rate thermal pad, designed to fill irregularities.

Generally, this material is shaped from putty(also called thermal putty pad), providing high compression rate under low compressive forces, maximizing contact area and optimizing heat dissipation.

GLPOLY low stress thermal gap pad has a range of thermal conductivity from 4.5W/mK to 8.0W/mK.

It deflects under low compressive forces, decreasing stress on component thus decreasing component failure.

That means low stress thermal putty pad is ideal for fragile component applications.

Here is a case for thermal putty pad application.

A customer designed a thermal management solution, him wanted to use one thermal gap pad to cover several heat source in different heights.

There were three heights in total 0.8mm, 0.12mm and 0.18mm, a 2.0mm thick thermal gap filler pad would be used.

For such an application, a traditional thermal gap pad was not the perfect solution due to higher hardness.

Customer made a comparative test between traditional thermal gap pad and thermal putty pad.

in traditional thermal gap pad test, huge compressive forces was applied, the thermal contact and thermal performance were not bad, but PCB was bent by compressive forces and risked that PCB would broke anytime.

In the trial, the electrical properties was failed.

But the test of thermal putty pad showed customer a positive result.

When compressive forces applied to thermal putty pad, it deflected easily and made contact to three heat sources perfect.

The most important is the PCB remained where it was.

In the reliability test, the device performed well as it was expected.

Test resut exhibited that thermal putty pad was the right one.

GLPOLY thermal putty pad is a high performance, high compression rate gap filling material.

It is ideal for irregulartities improving thermal contact, especially for multiple topography.

Now, this material has been applied to automotive radar in bulk production already.

GLPOLY has been providing diversified thermal interface materials and thermal solution for dJI, LG, CATL, NIO Automobile and DT Mobile etc, protecting their brand reputation for high reliability and performance.

Company Contact:

• Posted By: Goldlink Tongda Electronics Co., Ltd

• Phone: +8675527579310

• Address: Block 45, Baoan Shenzhen China, Shenzhen , Guangdong , China

• Email:

• Website: https://www.glpoly.com

• Business Description: Goldlink Tongda Electronics Co., Ltd is committed to the design, development and manufacture of Thermal Interface Materials, developing high quality TIMs and Thermal Solution is our first priority.
  
  Our outstanding R&D team are able to deliver the effective thermal solutions to customers for facing current advanced products.
  
  Products
  
  Busin ess includes Thermal Silicone Pad, Silicone Putty Pad, Thermal Tape, Thermal Silicone Grease, Two-part Thermal Gap Filler, Thermal Gel, Phase Change Materials and Non-Silicone based products.
  
  
  
  Applications
  
  We serve a multitude of industries worldwide including New energy vehicles, UAV, computer, telecommunications, consumer electronics, optical products, LED lighting, air flight, storage device, military and medical equipment, power conversion.