Thermal Management Solutions For Mobile Phone Or Smartphone - China

More powerful, faster and thinner mobile devices or smartphones that take the wonderful world in front of you.

New generation batteries that power new energy electric vehicle revolutionary development.

Massive amount of data exchange drives 5G/6G telecom and auto pilot striding forward.

When we enjoy the functions of devices and hugh amount of information that mobile devices or smartphones bring, we’ll get a byproduct---heat, it is what all the advanced devices and smartphones bring in common.

As heat is an avoidable byproduct of electronic device operation, it can degrade device’s performance and service life if no efficient management implemented.

To help you design excellent thermal solution, GLPOLY has developed a complete portfolio of thermal interface materials with proven performance and reliability to move heat away from from hear sources, keeping your devices run cooler and more stably.

Mobile phones or smartphones bring us the world, also the heat, you can feel that.

What thermal interface materials is ideal for smartphone thermal management? According to our professional experiences, two options are highly recommended.

The first one is thermal putty.

GLPOLY high performance thermal putty XK-G50 and XK-G60 are designed for smartphone thermal management.

This kind of material is non-dry out, non-drip off, compatible with high volume, automated dispense process.

It accommodates a variety of different gap thickness and deflects under low compressive forces, decreasing stress on component thun decreasing component faulire, especially for delicate components.

GLPOLY thermal putty provides thermal conductivity of 5-6W/mK, low thermal resistance and ultra thin bondline thickness, making heat transfer rapid and efficient.

XK-G60 has been applied to 5G projects of DT Mobile and DJI Drone for more than five years.

The second one is non-silicone thermal putty.

A 3.0W/mK non-silicone thermal putty XK-GN30 is preferred, as paste thermal interface material has a lower thermal resistance than solid ones.

This material is a non-silicone based, eliminating concerns about siloxane volatiles attaching to displayer or other silicone-sensitive components.

It is non-dry out, non-drip off too, wetting out interface to make heat transfer optimal.

XK-GN30 has been applied to auto head lights and Tinno Mobile in bulk production for years.

GLPOLY has partnered with Han’s Laser, DJI, DT Mobile, GAC Motor, NIO Automotive etc, thermal interface material have been applying to Laser, drone, automotive electronics and electric vehicle (EV) battery pack.

GLPOLY thermal interface materials help you design breakthroughs.

Company Contact:

• Posted By: Goldlink Tongda Electronics Co., Ltd

• Phone: +8675527579310

• Address: Block 45, Baoan Shenzhen China, Shenzhen , Guangdong , China

• Email:

• Website: https://www.glpoly.com

• Business Description: Goldlink Tongda Electronics Co., Ltd is committed to the design, development and manufacture of Thermal Interface Materials, developing high quality TIMs and Thermal Solution is our first priority.
  
  Our outstanding R&D team are able to deliver the effective thermal solutions to customers for facing current advanced products.
  
  Products
  
  Busin ess includes Thermal Silicone Pad, Silicone Putty Pad, Thermal Tape, Thermal Silicone Grease, Two-part Thermal Gap Filler, Thermal Gel, Phase Change Materials and Non-Silicone based products.
  
  
  
  Applications
  
  We serve a multitude of industries worldwide including New energy vehicles, UAV, computer, telecommunications, consumer electronics, optical products, LED lighting, air flight, storage device, military and medical equipment, power conversion.