4 France 
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1 Ireland 
Goldlink Tongda Electronics Co., Ltd
- Address: Block 45, Baoan Shenzhen China, Shenzhen, Guangdong , China
- Email:
- Phone: +8675527579310
Business description
Goldlink Tongda Electronics Co., Ltd is committed to the design, development and manufacture of Thermal Interface Materials, developing high quality TIMs and Thermal Solution is our first priority.Our outstanding R&D team are able to deliver the effective thermal solutions to customers for facing current advanced products.
Products
Busin ess includes Thermal Silicone Pad, Silicone Putty Pad, Thermal Tape, Thermal Silicone Grease, Two-part Thermal Gap Filler, Thermal Gel, Phase Change Materials and Non-Silicone based products.
Applications
We serve a multitude of industries worldwide including New energy vehicles, UAV, computer, telecommunications, consumer electronics, optical products, LED lighting, air flight, storage device, military and medical equipment, power conversion.
Latest listings
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Non Silicone Thermal Gap Pad Keeps Your Devices Performing StableResins and rosins and other resin derived materials - Goldlink Tongda Electronics Co., Ltd - China - February 25, 2020 - 0.30 Dollar US$GLPOLY silicone-free thermal pad XK-PN20F features three advantages of no silicone oil, high thermal performance and fiberglass reinforced, few of thermal interface material supplier can combine all three charateristics in one. GLPOLY introduced spec...
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High Performance Silicone Free Thermal GelResins and rosins and other resin derived materials - Goldlink Tongda Electronics Co., Ltd - China - February 25, 2020 - 0.70 Dollar US$some peers pursuaded customers to buy non-silicone thermal gel(thermal gap filler) and promise that no silicone contained. Actually, customers can not find problem in two or three months because the siloxane volatiles is not noticeable yet. Problems ...
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Silicone Free Thermal Pad Vs Bergquist Gap Pad2200sfRubber and elastomers - Goldlink Tongda Electronics Co., Ltd - China - November 25, 2019 - 1.00 Dollar US$Silicone free thermal inter materials are getting more and more attention recently. GLPOLY is at cutting edge of non silicone thermal interface materials development. Thermal solution design shows the tendency of diversification, for example, more am...
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Thermal Gel Substitutes For Chomerics Therm A Gap Gel60Rubber and elastomers - Goldlink Tongda Electronics Co., Ltd - China - November 25, 2019 - 1.30 Dollar US$GLPOLY The thermal gel XK-G60 is a high performance thermal management solution for electronics assembly, it is thermally conductive particle filled silicone gel with high conformability and thermally conductive properties. XK-G60 is formulated to ac...
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Thermal Pad Alternative To Bergquist Gp 5000s35Resins and rosins and other resin derived materials - Goldlink Tongda Electronics Co., Ltd - China - November 25, 2019 - 1.20 Dollar US$GLPOLY thermal pad is featuring a high thermal conductivity of 6.0W/mK, its higher than that of most of competitor. Compared with Bergquist gap pad 5000S35, the data will shows that GLPOLY thermal gap filler pad can perfectly substitute for the BQ 50...
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Thermal Silicone PuttyElectronic hardware and component parts and accessories - Goldlink Tongda Electronics Co., Ltd - China - March 6, 2017 - 29.50 Dollar US$Syringes packaging, automated production, high temperature resistance, and 100% thermal curing putty. XK-G series is a silicone based, high performance thermal Gel, filling with a variety of high-performance ceramic powder, possessing the features of...
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Thermal Gap Pad For EvElectronic hardware and component parts and accessories - Goldlink Tongda Electronics Co., Ltd - China - March 6, 2017 - 25.80 Dollar US$Low Density & Low Hardness Thermal pad series offers a high thermal conductivity and a low thermal resistance solution that outperforms common thermal pad and solution. This series of products are resilient and good amount of deformation, Suitabl...
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